Papan Sirkuit Cetak minangka landasan produk elektronik, penting banget kanggo produk sampeyan bisa mlaku kanthi stabil utawa ora suwe.Minangka PCB profesional lan Produsèn Majelis PCB, PCBFuture sijine Nilai dhuwur ing kualitas Papan sirkuit.
PCBFuture miwiti saka bisnis Fabrikasi PCB, banjur ngluwihi kanggo Déwan PCB lan layanan sumber komponen, saiki wis dadi salah siji sing paling turnkey produsen perakitan PCB.Kita nggawe akeh upaya kanggo nandur modal ing peralatan canggih kanggo teknologi sing luwih apik, sistem internal sing dioptimalake kanggo efisiensi sing luwih apik, nguatake tenaga kerja kanggo katrampilan sing luwih apik.
| Proses | Item | Kapabilitas Proses | |
| Informasi dhasar | Kapabilitas Produksi | Jumlah lapisan | 1-30 lapisan |
| Gandhewo lan twist | 0,75% standar, 0,5% majeng | ||
| Min.ukuran PCB rampung | 10 x 10 mm (0,4 x 0,4") | ||
| Maks.ukuran PCB rampung | 530 x 1000mm (20,9 x 47,24 ") | ||
| Multi-pencet kanggo vias wuta/dikubur | Multi-pencet Cycle≤3 kaping | ||
| Kekandelan papan rampung | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| Rampung toleransi kekandelan Papan | +/- 10% standar, +/- 0.1mm majeng | ||
| Rampung lumahing | HASL, HASL gratis timah, Emas kilat, ENIG, Pelapisan emas keras, OSP, Timah Immersion, perak Immersion, lsp | ||
| Rampung permukaan sing dipilih | ENIG+Gold finger, Flash emas+Gold finger | ||
| Jinis Bahan | FR4, Aluminium, CEM, Rogers, PTFE, Nelco, Polyimide / Polyester, etc. | Uga bisa tuku bahan minangka panyuwunan | |
| Tembaga foil | 1/3 oz ~ 10 oz | ||
| Tipe Prepreg | FR4 Prepreg, LD-1080(HDI) | 106, 1080, 2116, 7628, lsp. | |
| Tes sing bisa dipercaya | Kekuwatan kulit | 7,8 N/cm | |
| Fammability | 94V-0 | ||
| Kontaminasi ion | ≤1ug/cm² | ||
| Min.ketebalan dielektrik | 0,075 mm (3 mil) | ||
| Toleransi impedansi | +/- 10%, min bisa ngontrol +/- 7% | ||
| Lapisan njero & Lapisan njaba Transfer Gambar | Kapabilitas Mesin | Mesin Scrubbing | Ketebalan bahan: 0.11 ~ 3.2mm (4.33mil ~ 126mil) |
| Ukuran bahan: min.228 x 228 mm (9 x 9") | |||
| Laminator, Exposer | Ketebalan bahan: 0.11 ~ 6.0mm (4.33 ~ 236mil) | ||
| Ukuran materi: min 203 x 203 mm (8 x 8"), maksimal 609,6 x 1200 mm (24 x 30 ") | |||
| Garis Etching | Ketebalan bahan: 0.11 ~ 6.0mm (4.33mil ~ 236mil) | ||
| Ukuran bahan: min.177 x 177 mm (7 x 7") | |||
| Kapabilitas Proses lapisan njero | Min.jembaré garis jero / spasi | 0.075/0.075mm(3/3mil) | |
| Min.jarak saka pinggir bolongan kanggo konduktif | 0,2 mm (8 mil) | ||
| Min.ring annular lapisan njero | 0,1 mm (4 mil) | ||
| Min.reresik isolasi lapisan njero | 0,25mm (10mil) standar, 0,2mm (8mil) majeng | ||
| Min.jarak saka pinggir papan kanggo konduktif | 0,2 mm (8 mil) | ||
| Min.jembaré longkangan antarane lemah tembaga | 0,127 mm (5 mil) | ||
| Unbalance kekandelan tembaga kanggo inti utama | H / 1 oz, 1/2 oz | ||
| Maks.kekandelan tembaga rampung | 10oz | ||
| Kapabilitas Proses lapisan njaba | Min.jembaré garis njaba / spasi | 0.075/0.075mm(3/3mil) | |
| Min.ukuran pad bolongan | 0,3 mm (12 mil) | ||
| Kapabilitas Proses | Maks.ukuran tenting slot | 5 x 3mm (196,8 x 118mil) | |
| Maks.ukuran bolongan tent | 4,5 mm (177,2 mil) | ||
| Min.jembar tanah tenting | 0,2 mm (8 mil) | ||
| Min.ring annular | 0,1 mm (4 mil) | ||
| Min.BGA pitch | 0,5 mm (20 mil) | ||
| AOI | Kapabilitas Mesin | Orbotech SK-75 AOI | Ketebalan bahan: 0.05 ~ 6.0mm (2 ~ 236.2mil) |
| Ukuran bahan: max.597 ~ 597mm (23,5 x 23,5") | |||
| Mesin Ves Orbotech Kab | Ketebalan bahan: 0.05 ~ 6.0mm (2 ~ 236.2mil) | ||
| Ukuran bahan: max.597 ~ 597mm (23,5 x 23,5") | |||
| Ngebor | Kapabilitas Mesin | Mesin Bor MT-CNC2600 | Ketebalan bahan: 0.11 ~ 6.0mm (4.33 ~ 236mil) |
| Ukuran bahan: max.470 ~ 660mm (18,5 x 26") | |||
| Min.ukuran bor: 0.2mm (8 mil) | |||
| Kapabilitas Proses | Min.ukuran mata bor multi-hit | 0.55mm (21.6mil) | |
| Maks.rasio aspek (ukuran papan rampung VS ukuran Bor) | 12:01 | ||
| Toleransi lokasi bolongan (dibandhingake karo CAD) | +/- 3 yuta | ||
| Counterbore bolongan | PTH&NPTH, Sudut ndhuwur 130°, diameter ndhuwur <6.3mm | ||
| Min.jarak saka pinggir bolongan kanggo konduktif | 0,2 mm (8 mil) | ||
| Maks.ukuran mata bor | 6.5mm (256mil) | ||
| Min.ukuran slot multi-hit | 0.45mm (17.7mil) | ||
| Toleransi ukuran bolongan kanggo pers pas | +/-0,05mm (+/-2mil) | ||
| Min.toleransi ukuran slot PTH | +/- 0,15mm (+/-6mil) | ||
| Min.NPTH ukuran slot toleransi | +/-2mm(+/-78.7mil) | ||
| Min.jarak saka pinggir bolongan nganti konduktif (vias buta) | 0,23 mm (9 mil) | ||
| Min.ukuran bor laser | 0.1mm (+/-4mil) | ||
| Sudut bolongan Countersink & Diameter | Ndhuwur 82,90,120° | ||
| Proses Wetan | Kapabilitas Mesin | Panel & Pola plating line | Ketebalan bahan: 0.2 ~ 7.0mm (8 ~ 276mil) |
| Ukuran bahan: max.610 x 762 mm (24 x 30") | |||
| Deburring Maching | Ketebalan bahan: 0.2 ~ 7.0mm (8 ~ 276mil) | ||
| Ukuran bahan: min.203 x 203 mm (8" x 8") | |||
| Garis Desmear | Ketebalan bahan: 0.2mm ~ 7.0mm (8 ~ 276mil) | ||
| Ukuran bahan: max.610 x 762 mm (24 x 30") | |||
| Garis plating timah | Ketebalan bahan: 0.2 ~ 3.2mm (8 ~ 126mil) | ||
| Ukuran bahan: max.610 x 762 mm (24 x 30") | |||
| Kapabilitas Proses | Tembaga tembok bolongan ketebalan | rata-rata 25um (1mil) standar | |
| Kekandelan tembaga rampung | ≥18um(0,7mil) | ||
| Jembar garis min kanggo tandha etsa | 0,2 mm (8 mil) | ||
| Max.rampung bobot tembaga kanggo lapisan njero & njaba | 7 oz | ||
| Kekandelan tembaga sing beda | H / 1 oz, 1/2 oz | ||
| Topeng Solder & Silkscreen | Kapabilitas Mesin | Mesin Scrubbing | Ketebalan bahan: 0.5 ~ 7.0mm (20 ~ 276mil) |
| Ukuran bahan: min.228 x 228 mm (9 x 9") | |||
| Exposer | Ketebalan bahan: 0.11 ~ 7.0mm (4.3 ~ 276mil) | ||
| Ukuran bahan: max.635 x 813 mm (25 x 32") | |||
| Ngembangake mesin | Ketebalan bahan: 0.11 ~ 7.0mm (4.3 ~ 276mil) | ||
| Ukuran bahan: min.101 x 127 mm (4 x 5") | |||
| warna | Werna topeng solder | Ijo, ijo matte, kuning, ireng, biru, abang, putih | |
| Warna silkscreen | Putih, kuning, ireng, biru | ||
| Kapabilitas Topeng Solder | Min.bukaan topeng solder | 0,05 mm (2 mil) | |
| Maks.dipasang liwat ukuran | 0.65mm (25.6mil) | ||
| Min.jembaré kanggo jangkoan baris dening S / M | 0,05 mm (2 mil) | ||
| Min.solder topeng legenda jembaré | 0,2mm (8mil) standar, 0,17mm (7mil) majeng | ||
| Min.kekandelan topeng solder | 10um (0.4mil) | ||
| Ketebalan topeng solder kanggo liwat tent | 10um (0.4mil) | ||
| Min.jembaré garis lenga karbon / lenga | 0.25/0.35mm(10/14mil) | ||
| Min.tracer saka karbon | 0.06mm (2.5mil) | ||
| Min.jejak garis lenga karbon | 0,3 mm (12 mil) | ||
| Min.jarak saka pola karbon kanggo bantalan | 0,25 mm (10 mil) | ||
| Min.jembaré kanggo garis tutup topeng peelable / pad | 0,15 mm (6 mil) | ||
| Min.jembaré jembatan topeng solder | 0,1 mm (4 mil) | ||
| Topeng solder kekerasan | 6H | ||
| Kapabilitas Topeng Peelable | Min.jarak saka pola topeng peelable kanggo pad | 0,3 mm (12 mil) | |
| Maks.ukuran kanggo bolongan tenda topeng peelable (Miturut sablon) | 2mm (7.8mil) | ||
| Maks.ukuran kanggo bolongan tarub topeng peelable (Miturut printing aluminium) | 4,5 mm | ||
| Ketebalan topeng peelable | 0,2 ~ 0,5mm (8 ~ 20mil) | ||
| Kapabilitas Silkscreen | Min.jembaré garis silkscreen | 0.11mm (4.5mil) | |
| Min.dhuwur garis silkscreen | 0,58 mm (23 mil) | ||
| Min.jarak saka legenda kanggo pad | 0,17 mm (7 mil) | ||
| Lumahing Rampung | Kapabilitas Rampung lumahing | Maks.dawa driji emas | 50mm (2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nikel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) emas | ||
| driji emas | 3 ~ 5um(0.11 ~ 197mil) nikel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) emas | ||
| HASL | 0,4um(0,016mil) Sn/Pb | ||
| Mesin HASL Kab | Ketebalan bahan: 0.6 ~ 4.0mm (23.6 ~ 157mil) | ||
| Ukuran bahan: 127 x 127 mm ~ 508 x 635 mm (5 x 5" ~ 20 x 25") | |||
| Plating emas keras | 1-5u" | ||
| Immersion Tin | 0,8 ~ 1,5um(0,03 ~ 0,059mil) Timah | ||
| Kecemplung Perak | 0,1 ~ 0,3um(0,004 ~ 0,012mil) Ag | ||
| OSP | 0,2 ~ 0,5um(0,008 ~ 0,02mil) | ||
| Tes E | Kapabilitas Mesin | Flying probe tester | Ketebalan bahan: 0.4 ~ 6.0mm (15.7 ~ 236mil) |
| Ukuran bahan: maks.498 x 597mm(19.6 ~ 23.5") | |||
| Min.jarak saka test pad kanggo pinggiran Papan | 0,5 mm (20 mil) | ||
| Min.resistance konduktif | 5Ω | ||
| Maks.resistance insulasi | 250mΩ | ||
| Maks.voltase test | 500V | ||
| Min.ukuran test pad | 0,15 mm (6 mil) | ||
| Min.test pad kanggo pad spasi | 0,25 mm (10 mil) | ||
| Maks.test saiki | 200mA | ||
| Profiling | Kapabilitas Mesin | Tipe profiling | NC nuntun, V-cut, tab slot, bolongan cap |
| mesin nuntun NC | Ketebalan bahan: 0.05 ~ 7.0mm (2 ~ 276mil) | ||
| Ukuran bahan: max.546 x 648 mm (21,5 x 25,5") | |||
| Mesin potong V | Ketebalan bahan: 0.6 ~ 3.0mm (23.6 ~ 118mil) | ||
| Jembar materi maksimal kanggo potongan V: 457mm (18") | |||
| Kapabilitas Proses | Min.ukuran bit routing | 0.6mm (23.6mil) | |
| Min.outline toleransi | +/-0.1mm(+/-4mil) | ||
| Tipe sudut V-cut | 20°, 30°, 45°, 60° | ||
| V-cut toleransi amba | +/-5° | ||
| Toleransi registrasi V-cut | +/-0.1mm (+/-4mil) | ||
| Min.jarak driji emas | +/- 0,15mm (+/-6mil) | ||
| Toleransi sudhut bevelling | +/-5° | ||
| Bevelling tetep toleransi kekandelan | +/-0,127 mm(+/-5mil) | ||
| Min.radius njero | 0.4mm (15.7mil) | ||
| Min.jarak saka konduktif kanggo outline | 0,2 mm (8 mil) | ||
| Countersink / Counterbore toleransi ambane | +/-0.1mm(+/-4mil) | ||